EP2A25F672I6 vs EP2A25F672I7 Vergleich
Detaillierter Direktvergleich von EP2A25F672I6 von Intel und EP2A25F672I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A25F672I6 | EP2A25F672I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $178,00 | $198,00 |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm CMOS |
| Gehäuse | 672-ball FineLine BGA (FBGA-672) | 672-pin FC-FBGA |
| Core Voltage | 1.5 V | 1.5 V |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | 7 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | Yes (Embedded System Blocks) |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 24,320 |
| Gate Count | — | 900,000 |
| Maximum Frequency | — | 500 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Programmable I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS |
| Configuration Interface | — | JTAG |