EP2A25F672I6 vs EP2A25F672I7N Vergleich

Detaillierter Direktvergleich von EP2A25F672I6 von Intel und EP2A25F672I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672I6 EP2A25F672I7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $178,00 $175,00
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15 µm CMOS
Gehäuse 672-ball FineLine BGA (FBGA-672) 672-ball FC-FBGA
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 7
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM —
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Logic Elements (Cells) — 24,320
Typical Gate Count — 900,000
Maximum Internal Frequency — 500 MHz
Core Supply Voltage — 1.5 V
Pin/Ball Count — 672
Operating Temperature Grade — Industrial (I)
Configuration Interface — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Design Software — Quartus II
Lebenszyklusstatus — Not Recommended for New Designs (NRND)

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