EP2A25F672I6 vs EP2A25F672I7N Vergleich
Detaillierter Direktvergleich von EP2A25F672I6 von Intel und EP2A25F672I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A25F672I6 | EP2A25F672I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $178,00 | $175,00 |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm CMOS |
| Gehäuse | 672-ball FineLine BGA (FBGA-672) | 672-ball FC-FBGA |
| Core Voltage | 1.5 V | — |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | 7 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | — |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (Cells) | — | 24,320 |
| Typical Gate Count | — | 900,000 |
| Maximum Internal Frequency | — | 500 MHz |
| Core Supply Voltage | — | 1.5 V |
| Pin/Ball Count | — | 672 |
| Operating Temperature Grade | — | Industrial (I) |
| Configuration Interface | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Design Software | — | Quartus II |
| Lebenszyklusstatus | — | Not Recommended for New Designs (NRND) |