EP2A40B724C7 vs EP2A25B724C7 Vergleich
Detaillierter Direktvergleich von EP2A40B724C7 von Intel und EP2A25B724C7 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A40B724C7 | EP2A25B724C7 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $650,00 | $760,00 |
| Family | APEX II | APEX II |
| Logic Elements / Cells | 38,400 | — |
| Total System Gates | 1,500,000 | — |
| Embedded RAM Bits | 655,360 | — |
| Maximum User I/O | 540 | 540 |
| Core Supply Voltage | 1.425 V to 1.575 V (typ. 1.5 V) | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 0.15 µm CMOS, up to 8 metal layers, all-layer copper | 0.15 µm CMOS |
| Maximum Internal Frequency | 562 MHz | — |
| PLLs | 4 | 8 |
| Gehäuse | 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm | 724-BBGA / FCBGA (35 mm × 35 mm) |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) | — |
| Configuration Method | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices | — |
| MultiVolt I/O Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| DDR Memory Support | Yes (via ESB / I/O circuitry) | — |
| RoHS-Status | Non-compliant (lead-bearing FCBGA) | [DATA_NEEDED: RoHS status] |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 24,320 |
| System Gates | — | 900,000 |
| Internal Frequency | — | 500 MHz |
| Speed Grade | — | -7 |
| Embedded System Blocks (ESB) | — | Yes (dual-port RAM/ROM) |
| Multipliers | — | Yes (dedicated DSP blocks) |
| Configuration Interface | — | JTAG (IEEE 1149.1) |