EP2A40F672C8N vs EP2A40F672C6N Vergleich

Detaillierter Direktvergleich von EP2A40F672C8N von Intel und EP2A40F672C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A40F672C8N EP2A40F672C6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $122,00 $165,00
Family APEX II APEX II
Series EP2A40 —
Logic Family CMOS —
System Gates 1.5 M —
Logic Elements / Cells 38,400 —
Maximum Operating Frequency 376 MHz —
Propagation Delay 1.55 ns —
Technology Node 0.15 µm —
Process Feature All-layer copper, up to 8 metal layers —
Nominal Supply Voltage (VCCINT) 1.5 V —
Supply Voltage Range 1.425 V to 1.575 V —
User I/Os 492 —
Number of Pins / Balls 672 —
Package Type FC-FBGA (FineLine BGA) —
Package Dimensions 27 x 27 mm —
Ball Pitch 1.0 mm —
LVDS Data Rate 1 Gbps —
Embedded PLLs 4 —
Programming Interface JTAG (IEEE 1149.1) —
Operating Temperature (Commercial) 0 °C to 85 °C —
Speed Grade C8 C6 (per part number suffix)
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Logic Elements — 40,000
Maximum System Gates — 1,125,000
Embedded RAM Bits — 442,368
Embedded System Blocks (ESBs) — 160
Maximum User I/O Pins — [DATA_NEEDED: maximum user I/O count]
Core Voltage — 1.5 V
I/O Standards Supported — LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V
Gehäuse — 672-ball FineLine BGA
Betriebstemperatur — Commercial (0C to +85C)
Configuration Methods — Passive Serial, Passive Parallel, JTAG
Montageart — Surface Mount
Process Technology — SRAM-based, 0.18 um (per family datasheet)
PLL Count — [DATA_NEEDED: PLL count]

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