EP2A40F672I-9 vs EP2A40F672C7 Vergleich

Detaillierter Direktvergleich von EP2A40F672I-9 von Intel und EP2A40F672C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A40F672I-9 EP2A40F672C7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $165,00 $195,00
Family APEX II APEX II
Device EP2A40 —
Logic Elements 38,400 38,400
System Gates 1,500,000 1,500,000
Maximum Operating Frequency 366 MHz —
Process Technology 0.15 µm CMOS 0.15 µm CMOS, all-layer copper, up to 8 metal layers
Core Voltage (VCCINT) 1.5 V —
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) —
Betriebstemperatur -40 °C to +100 °C (Industrial) —
Gehäuse 672-pin FC-FBGA (Fine-pitch Ball Grid Array) 672-ball FC-FBGA (FineLine BGA)
Speed Grade -9 —
True-LVDS Channels Yes (dedicated) —
Embedded Memory Dual-port RAM, single-port RAM, ROM, CAM (via ESBs) —
Hot Socketing Supported —
Configuration Mode Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG —
Moisture Sensitivity Level MSL 3 —
Peak Reflow Temperature 220 °C —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Macro Cells — 2,560
Maximum User I/O — 492
Core Voltage — 1.5 V
I/O Voltage Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Pin-to-Pin Delay — 1.55 ns (C7 speed grade)
Maximum Internal Frequency — 562 MHz
High-Speed Interface — 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport
PLLs — 4
Package Dimensions — 27 x 27 mm, 1.0 mm pitch
Montageart — Surface Mount
Operating Temperature Grade — Commercial (per 'C' suffix in speed grade)
Lead-Free — Yes

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