EP2A40F672I-9 vs EP2A40F672C8 Vergleich

Detaillierter Direktvergleich von EP2A40F672I-9 von Intel und EP2A40F672C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A40F672I-9 EP2A40F672C8
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $165,00 $68,00
Family APEX II APEX II
Device EP2A40 —
Logic Elements 38,400 —
System Gates 1,500,000 —
Maximum Operating Frequency 366 MHz —
Process Technology 0.15 µm CMOS 0.15-micron all-layer copper, up to 8 metal layers
Core Voltage (VCCINT) 1.5 V —
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) —
Betriebstemperatur -40 °C to +100 °C (Industrial) 0 C to 85 C (commercial)
Gehäuse 672-pin FC-FBGA (Fine-pitch Ball Grid Array) —
Speed Grade -9 —
True-LVDS Channels Yes (dedicated) —
Embedded Memory Dual-port RAM, single-port RAM, ROM, CAM (via ESBs) Up to 1.5 Mbits
Hot Socketing Supported —
Configuration Mode Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG —
Moisture Sensitivity Level MSL 3 —
Peak Reflow Temperature 220 °C —
RoHS-Status [DATA_NEEDED: RoHS status] —
Logic Family — CMOS
Typical Logic Elements (LEs) — 40,000
User I/Os — 492 pins
Anzahl der Pins — 672
Package Type — FineLine BGA, 27 x 27 mm, 1.0 mm pitch
Propagation Delay (speed grade C8) — 1.55 ns
Phase-Locked Loops (PLLs) — 4
LVDS Signaling Support — Up to 1 Gbps
Multipliers — Embedded multiplier blocks
I/O Standards — LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS
Montageart — Surface Mount (BGA)

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