EP2AGX125EF29C4G vs EP2AGX125EF29I5G Vergleich
Detaillierter Direktvergleich von EP2AGX125EF29C4G von Intel und EP2AGX125EF29I5G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX125EF29C4G | EP2AGX125EF29I5G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.100,00 | $861,62 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 118,143 | 118,143 |
| Number of LABs/CLBs | 4,964 | — |
| Total RAM Bits | 8,315,904 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Voltage - Supply | 0.9 V (core) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Gehäuse / Bauform | 780-BBGA, FCBGA (29x29 mm, 1.0 mm pitch) | — |
| Speed Grade | C4 | — |
| Process Technology | 40 nm | 40 nm |
| Maximum Operating Frequency | 500 MHz | — |
| RoHS-Status | Compliant (G suffix = Pb-free) | Compliant |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| Gehäuse | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |