EP2AGX260EF29C5G vs EP2AGX260EF29I5N Vergleich

Detaillierter Direktvergleich von EP2AGX260EF29C5G von Intel und EP2AGX260EF29I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGX260EF29C5G EP2AGX260EF29I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.515,00 $1.950,00
Family Arria II GX Arria II
Logic Elements (LE) 260,000 —
Total Memory Bits 12,038,144 bits —
Embedded RAM Bits 244,188 bits —
Number of LABs 10,260 —
User I/O Count 372 —
Gehäuse 780-ball FBGA (FineLine BGA) —
Package Code HBGA, 29 mm —
Speed Grade C5 (commercial -5C to 85C) 5
Process Node 40 nm —
Supply Voltage - Core [DATA_NEEDED: VCCINT nominal] —
Transceivers Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] —
DSP Blocks 18x18 multipliers, count [DATA_NEEDED] —
Betriebstemperatur 0C to 85C (commercial) —
Montageart Surface Mount Surface Mount
Lead-Free / RoHS Yes (G suffix) —
MSL-Level [DATA_NEEDED] [DATA_NEEDED: MSL level]
Series — Arria II GX
Logic Elements — 244,188
Adaptive Logic Modules (ALMs) — 10260 LABs
Embedded Memory Bits — 12,038,144 bits
Maximum User I/O — 372
Number of I/O — 372
Number of Transceivers — 12
Transceiver Data Rate (CPLL) — up to 3.75 Gbps
Transceiver Data Rate (Channel PLL) — up to 5 Gbps
18x18 Multipliers — 1,152
Operating Temperature Grade — Industrial (-40C to +100C)
Package Type — 780-BBGA, FCBGA (Flip-Chip BGA)
Package Dimensions — 29 mm x 29 mm
Lead Free — Yes
RoHS-Status — Compliant
Process Technology — CMOS
Configuration — JTAG / passive serial / fast passive parallel

Datenblätter & Ressourcen

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