EP2AGX260EF29C5N vs EP2AGX260EF29C5G Vergleich
Detaillierter Direktvergleich von EP2AGX260EF29C5N von Intel und EP2AGX260EF29C5G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX260EF29C5N | EP2AGX260EF29C5G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.565,00 | $2.515,00 |
| Series | Arria II GX | — |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 244,188 | 260,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 10,238 Kbit | — |
| Number of LABs/CLBs | 10,260 | — |
| Number of Logic Cells | 244,188 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | Up to 5 Gbps | — |
| PLL Count | 8 (4 enhanced + 4 fast PLLs) | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Betriebstemperatur | 0 °C to +85 °C (Commercial) | 0C to 85C (commercial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED] |
| RoHS-Status | Compliant (per DigiKey listing) | — |
| Total Memory Bits | — | 12,038,144 bits |
| Embedded RAM Bits | — | 244,188 bits |
| Number of LABs | — | 10,260 |
| User I/O Count | — | 372 |
| Gehäuse | — | 780-ball FBGA (FineLine BGA) |
| Package Code | — | HBGA, 29 mm |
| Speed Grade | — | C5 (commercial -5C to 85C) |
| Process Node | — | 40 nm |
| Supply Voltage - Core | — | [DATA_NEEDED: VCCINT nominal] |
| Transceivers | — | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] |
| DSP Blocks | — | 18x18 multipliers, count [DATA_NEEDED] |
| Lead-Free / RoHS | — | Yes (G suffix) |