EP2AGX260EF29C5N vs EP2AGX260EF29I5N Vergleich
Detaillierter Direktvergleich von EP2AGX260EF29C5N von Intel und EP2AGX260EF29I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX260EF29C5N | EP2AGX260EF29I5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.565,00 | $1.950,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II GX | Arria II |
| Logic Elements (LE) | 244,188 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 10,238 Kbit | — |
| Number of LABs/CLBs | 10,260 | — |
| Number of Logic Cells | 244,188 | — |
| Number of I/O | 372 | 372 |
| Number of Transceivers | 12 | 12 |
| Transceiver Data Rate | Up to 5 Gbps | — |
| PLL Count | 8 (4 enhanced + 4 fast PLLs) | — |
| Process Technology | 40 nm | CMOS |
| Core Voltage | 0.9 V | — |
| Betriebstemperatur | 0 °C to +85 °C (Commercial) | — |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| RoHS-Status | Compliant (per DigiKey listing) | Compliant |
| Logic Elements | — | 244,188 |
| Adaptive Logic Modules (ALMs) | — | 10260 LABs |
| Embedded Memory Bits | — | 12,038,144 bits |
| Maximum User I/O | — | 372 |
| Transceiver Data Rate (CPLL) | — | up to 3.75 Gbps |
| Transceiver Data Rate (Channel PLL) | — | up to 5 Gbps |
| 18x18 Multipliers | — | 1,152 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | 5 |
| Package Dimensions | — | 29 mm x 29 mm |
| Lead Free | — | Yes |
| Configuration | — | JTAG / passive serial / fast passive parallel |