EP2AGX260EF29I3G vs EP2AGX260EF29C5G Vergleich
Detaillierter Direktvergleich von EP2AGX260EF29I3G von Intel und EP2AGX260EF29C5G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX260EF29I3G | EP2AGX260EF29C5G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.480,00 | $2.515,00 |
| Series | Arria II GX | — |
| Family | Arria II GX | Arria II GX |
| Logic Elements / Cells | 244,188 | — |
| Total RAM Bits | 12,038,144 | — |
| Number of I/O | 372 | — |
| Number of Logic Blocks | [DATA_NEEDED: logic blocks count] | — |
| Number of Gates | [DATA_NEEDED: gate count] | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Operating Frequency (max) | 500 MHz | — |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to 85C (commercial) |
| Gehäuse / Bauform | 780-BBGA, FCBGA | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements (LE) | — | 260,000 |
| Total Memory Bits | — | 12,038,144 bits |
| Embedded RAM Bits | — | 244,188 bits |
| Number of LABs | — | 10,260 |
| User I/O Count | — | 372 |
| Gehäuse | — | 780-ball FBGA (FineLine BGA) |
| Package Code | — | HBGA, 29 mm |
| Speed Grade | — | C5 (commercial -5C to 85C) |
| Process Node | — | 40 nm |
| Supply Voltage - Core | — | [DATA_NEEDED: VCCINT nominal] |
| Transceivers | — | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] |
| DSP Blocks | — | 18x18 multipliers, count [DATA_NEEDED] |
| Lead-Free / RoHS | — | Yes (G suffix) |
| MSL-Level | — | [DATA_NEEDED] |