EP2AGX260EF29I5 vs EP2AGX260EF29I5N Vergleich

Detaillierter Direktvergleich von EP2AGX260EF29I5 von Intel und EP2AGX260EF29I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGX260EF29I5 EP2AGX260EF29I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.235,00 $1.950,00
Manufacturer Intel (formerly Altera) —
Family Arria II GX Arria II
Logic Elements (LE) 244,188 —
Adaptive Logic Modules (ALM) 244,188 —
Logic Array Blocks (LAB) 10,260 —
Embedded Memory 12,038,144 bits —
User I/O Count 372 —
Process Technology 40 nm CMOS CMOS
Core Voltage 0.9 V —
Maximum Core Frequency 500 MHz —
Transceivers 8 high-speed transceivers up to 3.75 Gbps —
DSP Blocks 256 —
Gehäuse 780-pin FCBGA (Flip-Chip Ball Grid Array) —
Betriebstemperatur Industrial -40C to +100C —
PCIe Hard IP Yes, Gen1/Gen2 —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Compliant Compliant
Series — Arria II GX
Logic Elements — 244,188
Adaptive Logic Modules (ALMs) — 10260 LABs
Embedded Memory Bits — 12,038,144 bits
Maximum User I/O — 372
Number of I/O — 372
Number of Transceivers — 12
Transceiver Data Rate (CPLL) — up to 3.75 Gbps
Transceiver Data Rate (Channel PLL) — up to 5 Gbps
18x18 Multipliers — 1,152
Operating Temperature Grade — Industrial (-40C to +100C)
Speed Grade — 5
Package Type — 780-BBGA, FCBGA (Flip-Chip BGA)
Package Dimensions — 29 mm x 29 mm
MSL-Level — [DATA_NEEDED: MSL level]
Lead Free — Yes
Configuration — JTAG / passive serial / fast passive parallel

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern