EP2AGX65DF25C6N vs EP2AGX65DF25I3G Vergleich
Detaillierter Direktvergleich von EP2AGX65DF25C6N von Intel und EP2AGX65DF25I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2AGX65DF25I3G - Arria II GX FPGA, 65K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3G ✓ AktivSpezifikationsvergleich
| Parameter | EP2AGX65DF25C6N | EP2AGX65DF25I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $89,40 | $920,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 60214 | — |
| Logic Array Blocks (LABs) | 2530 | — |
| Embedded Memory (bits) | 5371904 | 5,371,904 |
| M9K Block Memory | 4.5 Mb | — |
| Distributed RAM | 1.4 Mb | — |
| Embedded 18x18 Multipliers | 12 | — |
| Fractional PLLs | 8 | — |
| Maximum User I/Os | 252 | — |
| Transceivers | Up to 12 channels, 3.75 Gbps | Up to 12 |
| PCI Express Hard IP | Gen1 x1/x4 | — |
| Process Technology | 40 nm CMOS, low power | 40 nm |
| Core Voltage (VCCINT) | 0.9 V | — |
| Gehäuse | 572-ball FCBGA, 25 x 25 mm (DF25) | 572-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | 6 (commercial, slow) | I3 |
| Betriebstemperatur | 0 C to +85 C (commercial) | — |
| RoHS-Status | Lead-free, RoHS compliant | Compliant |
| Logic Elements | — | 60,214 |
| User I/O Count | — | 252 |
| Core Voltage | — | 0.9 V |
| Transceiver Data Rate | — | Up to 3.75 Gbps |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| DSP Blocks | — | Yes (embedded multipliers) |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Montageart | — | Surface Mount |