EP2AGX65DF25I3N vs EP2AGX65DF25I3G Vergleich
Detaillierter Direktvergleich von EP2AGX65DF25I3N von Intel und EP2AGX65DF25I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2AGX65DF25I3N - Arria II GX FPGA, 60K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3N ⚠ Letzte BestellmöglichkeitIntel
EP2AGX65DF25I3G - Arria II GX FPGA, 65K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3G ✓ AktivSpezifikationsvergleich
| Parameter | EP2AGX65DF25I3N | EP2AGX65DF25I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $125,90 | $920,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | 60,214 |
| Logic Array Blocks (LABs) | 2,530 | — |
| Total Embedded Memory | 2,531 Kbits | — |
| M9K Memory Blocks | 4.4 Mbits (approx 488 blocks) | — |
| MLAB Memory | 1.4 Mbits | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Transceivers | 8 channels | Up to 12 |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| User I/O Count | 252 | 252 |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C ambient) | Industrial (-40C to +100C) |
| Gehäuse | 572-ball FCBGA (flip-chip BGA) | 572-ball FCBGA (Flip-Chip BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | AS, PS, FPP, JTAG |
| Hard IP for PCIe | PCIe Gen1 / Gen2 (x1/x2/x4) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Embedded Memory (bits) | — | 5,371,904 |
| Transceiver Data Rate | — | Up to 3.75 Gbps |
| Speed Grade | — | I3 |
| DSP Blocks | — | Yes (embedded multipliers) |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Montageart | — | Surface Mount |