EP2AGX65DF29I5G vs EP2AGX65DF29I3N Vergleich
Detaillierter Direktvergleich von EP2AGX65DF29I5G von Intel und EP2AGX65DF29I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX65DF29I5G | EP2AGX65DF29I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $689,49 | $175,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | Intel FPGA (formerly Altera Arria II GX) |
| Logic Elements (LE) | 60,214 | 60214 |
| Embedded Memory | 5,371,904 bits | — |
| Logic Array Blocks (LABs) | 2,530 | — |
| User I/O Count | 364 | 364 |
| DSP Blocks | 17 (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 8 channels up to 6.3125 Gbps | — |
| Hard PCIe Controllers | 2 (Gen1/Gen2, endpoint + root port) | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage | 0.9 V | 0.9 V |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVDS, LVTTL, LVCMOS) | — |
| Gehäuse | 780-ball FCBGA (Flip-Chip BGA), 29 mm x 29 mm | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +100C (Industrial) | -40 C to +100 C (Industrial) |
| Configuration Modes | FPP, AS, JTAG, PS | — |
| Security | AES-256 bitstream encryption | — |
| RoHS-Status | Compliant | Compliant (Pb-free N suffix) |
| Process Node | — | 40 nm TSMC low-power |
| Number of LABs/CLBs | — | 2530 |
| Embedded Memory (bits) | — | 5371904 |
| Total RAM Bits | — | 5,371,904 |
| Operating Frequency (max) | — | 500 MHz |
| Speed Grade | — | -3 |
| Transceivers | — | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |