EP2AGX95EF35I3G vs EP2AGX95EF35C6N Vergleich
Detaillierter Direktvergleich von EP2AGX95EF35I3G von Intel und EP2AGX95EF35C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX95EF35I3G | EP2AGX95EF35C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $280,00 | $1.390,00 |
| Series | Arria II GX | — |
| Logic Elements | 89,178 | — |
| Total RAM Bits | 6,839,296 | — |
| Number of LABs/CLBs | 452 | — |
| User I/O Count | 452 | — |
| Gehäuse | 1152-BBGA, FCBGA | 1152-ball FBGA (FineLine BGA), 35 mm |
| Montageart | Surface Mount | — |
| Betriebstemperatur | -40C to +100C (Industrial) | Commercial (0C to +85C) |
| Versorgungsspannung | 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O | — |
| Transceiver Count | Up to 12 channels | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | 484 (18x18 multipliers) | — |
| Embedded Hard IP | PCI Express Gen1/Gen2 endpoint/root-port | — |
| Memory Interfaces | DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+ | — |
| Process Technology | 40 nm TSMC | 40 nm TSMC |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GX |
| Device | — | EP2AGX95 |
| Logic Elements (LE) | — | 89,178 |
| Logic Array Blocks (LABs) | — | 4,747 |
| Adaptive Logic Modules (ALMs) | — | 36,480 |
| Embedded Memory (Bits) | — | 6,839,296 |
| Embedded Multipliers (18x18) | — | 448 |
| User I/Os | — | 452 |
| Transceiver Channels | — | Up to 12 |
| Transceiver Data Rate (Max) | — | 6.375 Gbps |
| PCIe Hard IP | — | PCIe Gen2 x4 |
| Core Voltage | — | 0.9 V |
| Speed Grade | — | C6 |
| Memory Standards | — | DDR3 / DDR2 / LPDDR2 / QDRII+ |