EP2AGZ300FF35I4 vs EP2AGZ300FF35C3G Vergleich

Detaillierter Direktvergleich von EP2AGZ300FF35I4 von Intel und EP2AGZ300FF35C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FF35I4 EP2AGZ300FF35C3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.015,00 $1.395,00
Family Arria II GZ —
Logic Elements 298,000 300,000
Configurable Logic Blocks (LABs/CLBs) 11,920 —
Maximum User I/O 554 —
Operating Frequency (Max) 500 MHz —
Process Technology 40 nm 40 nm TSMC
Core Voltage 0.9 V —
Gehäuse 1152-ball FC-FBGA (FF35) FCBGA-1152 (35 mm)
Temperature Grade Industrial (-40 C to +100 C) Commercial (0 C to 85 C junction)
Number of Pins/Balls 1152 —
Terminal Form Ball (BGA) —
Transceivers 12.5 Gbps integrated 16 channels, up to 6.375 Gbps
Embedded Memory M20K blocks (distributed) 17,133 Kbit
DSP Blocks Hard DSP columns (variable precision) 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes
PCIe Support PCIe Gen2 hard IP —
Montageart Surface Mount (flip-chip BGA) —
RoHS-Status Compliant Compliant
Lead-Free Yes —
Series — Arria II GZ
Adaptive Logic Modules (ALMs) — 119,088
Hard PCIe Controllers — Up to 12 (Gen2 endpoint/root-port)
User I/Os — 1,288
I/O Banks — 12
Package Family — BGA (Flip-Chip)
Speed Grade — 3 (mid-performance)
Configuration Method — Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel
Hard Memory Controller — DDR3 up to 800 MHz, DDR2, QDR II+

Datenblätter & Ressourcen

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