EP2AGZ300FF35I4 vs EP2AGZ300FF35I4N Vergleich
Detaillierter Direktvergleich von EP2AGZ300FF35I4 von Intel und EP2AGZ300FF35I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FF35I4 | EP2AGZ300FF35I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.015,00 | $1.925,00 |
| Family | Arria II GZ | Field Programmable Gate Array (FPGA) |
| Logic Elements | 298,000 | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | — |
| Gehäuse | 1152-ball FC-FBGA (FF35) | — |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | — |
| Embedded Memory | M20K blocks (distributed) | — |
| DSP Blocks | Hard DSP columns (variable precision) | — |
| PCIe Support | PCIe Gen2 hard IP | — |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Series | — | Arria II GZ |
| Number of LABs/CLBs | — | 11,920 |
| Total RAM Bits | — | 18,854,912 bits |
| Number of I/O | — | 554 |
| Supply Voltage Core | — | 0.9 V |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Package Type | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Supplier Device Package | — | 1152-FBGA (35x35) |