EP2AGZ300FH29C4G vs EP2AGZ300FH29I4G Vergleich

Detaillierter Direktvergleich von EP2AGZ300FH29C4G von Intel und EP2AGZ300FH29I4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FH29C4G EP2AGZ300FH29I4G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.700,00 $1.350,00
Series Arria II GZ —
Logic Elements 300,000 (approx.) —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Total RAM Bits [DATA_NEEDED: embedded memory bits] —
Number of I/O [DATA_NEEDED: max user I/O count] 281
Number of Transceivers [DATA_NEEDED: transceiver count and rate] —
Number of Multipliers (18x18) [DATA_NEEDED: DSP block count] —
Voltage - Supply [DATA_NEEDED: core and I/O supply rails] —
Betriebstemperatur 0C to +85C (commercial grade, suffix C) —
Grade C4 (commercial, speed grade 4) —
Montageart Surface Mount Surface Mount (BGA)
Gehäuse / Bauform 780-BGA (Fine-pitch BGA, FH29) —
MSL-Level [DATA_NEEDED: MSL moisture sensitivity level] [DATA_NEEDED: MSL rating]
RoHS-Status Compliant Compliant
Process Technology 40 nm —
Lead-Free Yes Yes (per RoHS)
Manufacturer Intel (formerly Altera) —
Family — Arria II GZ (AGZ)
Logic Elements (LE) — 300,000 (approx., per family member)
Package Type — 780-ball Flip-Chip BGA (FineLine)
Package Code — FH29 (29x29 mm)
Betriebstemperaturbereich — -40C to +100C (industrial, I-grade)
Speed Grade — I4
Process Node — 40 nm TSMC
Supply Voltage (Core) — 0.9 V (typical)
Configuration Method — JTAG / Passive Serial / Fast Passive Parallel
Transceivers — Embedded multi-gigabit transceivers (per family)
DSP Blocks — Yes (variable-precision, per family)
Block RAM — Embedded M9K / M144K blocks

Datenblätter & Ressourcen

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