EP2AGZ300FH29I3N vs EP2AGZ350FH29I3G Vergleich

Detaillierter Direktvergleich von EP2AGZ300FH29I3N von Intel und EP2AGZ350FH29I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2AGZ300FH29I3N EP2AGZ300FH29I3N - 298K LE Arria II GZ FPGA 780-FCBGA | Intel

EP2AGZ300FH29I3N - 298K LE Arria II GZ FPGA 780-FCBGA | Intel

EP2AGZ300FH29I3N ✗ Abgekündigt

Spezifikationsvergleich

Parameter EP2AGZ300FH29I3N EP2AGZ350FH29I3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Ende des Lebenszyklus Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.380,00 $1.450,00
Family Arria II GZ Arria II GZ
Logic Elements 298,000 —
Logic Array Blocks (LABs) 11,920 —
Embedded Memory 18,854,912 bits —
User I/O Pins 281 —
Transceivers 12 Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet)
Max Transceiver Speed 6.375 Gbps —
Process Node 40 nm 40 nm
Core Voltage 0.9 V —
Gehäuse 780-FCBGA (H-BGA, 29x29 mm) 780-FBGA (FineLine BGA, FH29)
Speed Grade I3 —
Betriebstemperatur -40C to +100C (Industrial) —
Montageart Surface Mount Surface Mount
PLLs 8 (4 general-purpose + 4 transceiver) —
Global Clock Networks 16 —
RoHS-Status Compliant Compliant
Lebenszyklusstatus End of Life (EOL) —
Logic Elements (LE) — 350000 (approximately)
User I/O Count — 281
Temperature Grade — Industrial (-40C to +100C)
Betriebstemperaturbereich — -40C to +100C
Supply Voltage Core — [DATA_NEEDED: VCC core voltage]
Memory Interface — DDR3 with read/write leveling support (family feature)
Embedded Multipliers — 18x18 hardware multipliers (family feature)
Configuration Method — Serial or parallel via Quartus II (family feature)
MSL-Level — 3 (per BGA package handling guidelines)
Lead Free — Yes
Halogenfrei — [DATA_NEEDED: halogen free status]

Datenblätter & Ressourcen

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