EP2AGZ300FH29I4G vs EP2AGZ300FH29C4G Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29I4G von Intel und EP2AGZ300FH29C4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29I4G | EP2AGZ300FH29C4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.350,00 | $1.700,00 |
| Family | Arria II GZ (AGZ) | — |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | [DATA_NEEDED: max user I/O count] |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Betriebstemperaturbereich | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | — |
| Process Node | 40 nm TSMC | — |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | — |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Lead-Free | Yes (per RoHS) | Yes |
| Series | — | Arria II GZ |
| Logic Elements | — | 300,000 (approx.) |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Total RAM Bits | — | [DATA_NEEDED: embedded memory bits] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count and rate] |
| Number of Multipliers (18x18) | — | [DATA_NEEDED: DSP block count] |
| Voltage - Supply | — | [DATA_NEEDED: core and I/O supply rails] |
| Betriebstemperatur | — | 0C to +85C (commercial grade, suffix C) |
| Grade | — | C4 (commercial, speed grade 4) |
| Gehäuse / Bauform | — | 780-BGA (Fine-pitch BGA, FH29) |
| Process Technology | — | 40 nm |
| Manufacturer | — | Intel (formerly Altera) |