EP2AGZ300FH29I4G vs EP2AGZ300FH29I3G Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29I4G von Intel und EP2AGZ300FH29I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29I4G | EP2AGZ300FH29I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.350,00 | $1.340,00 |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | 300,000 |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Betriebstemperaturbereich | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | -3 |
| Process Node | 40 nm TSMC | 40 nm TSMC |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | — |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Embedded Memory | — | 18,520 Kbits |
| DSP Blocks (18x18 multipliers) | — | 720 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Number of Transceivers | — | 24 |
| Gehäuse | — | 780-pin FineLine BGA (FH29), 29x29 mm |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Operating Voltage (Core) | — | 0.9 V |
| External Memory Interface | — | DDR3 up to 800 MHz |