EP2AGZ300HF40C3G vs EP2AGZ350HF40C3N Vergleich
Detaillierter Direktvergleich von EP2AGZ300HF40C3G von Intel und EP2AGZ350HF40C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300HF40C3G | EP2AGZ350HF40C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.950,00 | $2.150,00 |
| Series | Arria II GZ | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | — |
| User I/O Count | 734 | — |
| Gehäuse | 1517-ball FBGA | 1517-ball FCBGA (HF40) |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| Betriebstemperatur | Commercial (0C to +85C) | — |
| Embedded Memory | Approx. 18.7 Mbits | — |
| DSP Blocks | 800+ (18x18 multipliers) | [DATA_NEEDED: DSP block count] |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm low-power |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| RoHS-Status | Pb-free finish - compliant | — |
| Montageart | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Family | — | Arria II GZ |
| Logic Elements | — | 348,500 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| Transceivers | — | Up to 24 (per family datasheet) |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |