EP2AGZ350FH29C3G vs EP2AGZ300FH29C4N Vergleich
Detaillierter Direktvergleich von EP2AGZ350FH29C3G von Intel und EP2AGZ300FH29C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ350FH29C3G | EP2AGZ300FH29C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.350,00 | $1.395,00 |
| Logic Elements | 350,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 119,200 |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | 281 |
| Transceivers | 24 channels | Up to 28 (up to 6.375 Gbps) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | C4 |
| Betriebs-Sperrschichttemperatur | 0C to +85C | — |
| Gehäuse | 780-ball FBGA (HBGA, 29x29 mm) | 780-ball FC-HFBGA (FH29) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GZ |
| Logic Elements (LE) | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory (bits) | — | 18,854,912 |
| DSP Blocks | — | [DATA_NEEDED: exact DSP block count for EP2AGZ300] |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (N suffix) |