EP2AGZ350HF40C4G vs EP2AGZ350HF40C3N Vergleich

Detaillierter Direktvergleich von EP2AGZ350HF40C4G von Intel und EP2AGZ350HF40C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ350HF40C4G EP2AGZ350HF40C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.015,40 $2.150,00
Family Arria II GZ Arria II GZ
Logic Elements (LE) 350,000 —
Embedded Memory (bits) 20,480 Kbits —
User Accessible RAM (bits) 4.7 Mbits —
DSP Blocks 534 (18x18 multipliers) [DATA_NEEDED: DSP block count]
Transceivers [DATA_NEEDED: transceiver channel count for HF40 package] Up to 24 (per family datasheet)
Transceiver Data Rate up to 3.125 Gbps Up to 6.553 Gbps
PLLs 8 (fractional) —
Maximum User I/O 606 —
Hard Memory Controllers Yes (DDR3, DDR2, QDR) —
Hard PCIe Gen2 Endpoint Yes —
Process Node 40 nm —
Gehäuse FBGA-1517 (HF40) 1517-ball FCBGA (HF40)
Pitch 1.0 mm —
Speed Grade 4 —
Betriebstemperatur 0C to +85C (Commercial) —
Lead-Free / RoHS Lead-Free / RoHS Compliant —
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel, Active Serial —
Logic Elements — 348,500
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Logic Array Blocks (LABs) — 13,940
Embedded Memory Bits — 21,270,528
Embedded Memory Blocks (M9K) — [DATA_NEEDED: M9K count]
User I/Os — 734
Core Voltage — 0.9 V
Process Technology — 40 nm low-power
Operating Temperature Grade — Commercial (C3)
Configuration Mode — FPP / AS / JTAG
Montageart — Surface Mount (flip-chip BGA)

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