EP2C20F256C6N vs EP2C20F256I8N Vergleich
Detaillierter Direktvergleich von EP2C20F256C6N von Intel und EP2C20F256I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C20F256C6N | EP2C20F256I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $41,50 | $43,50 |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 18,752 | — |
| Embedded Memory Bits | 239,616 bits (52 M4K blocks) | — |
| Embedded Multipliers | 26 (18 x 18) | — |
| User I/O Pins | 152 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Gehäuse | 256-ball FineLine BGA (FBGA-256) | 256-FBGA (17x17 mm) |
| Speed Grade | C6 (commercial) | — |
| Process Technology | 90 nm low-k CMOS | 90 nm CMOS, low-k dielectric |
| Configuration Modes | AS, PS, JTAG | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Supply Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Pb-free (lead-free) | Compliant |
| Logic Elements / Cells | — | 18,752 |
| Total RAM Bits | — | 239,616 bits |
| Logic Array Blocks (LABs) | — | 1,172 |
| User I/Os | — | 152 |
| Number of Gates | — | Not specified by manufacturer [DATA_NEEDED: gate count equivalent] |
| Core Supply Voltage | — | 1.15 V to 1.25 V (1.2 V typical) |
| Betriebstemperaturbereich | — | -40C to +100C (TJ, industrial) |
| Maximum Internal Frequency | — | 402.58 MHz (per datasheet typical) |
| Embedded Multipliers (18x18) | — | Up to 52 |
| Configuration Interface | — | JTAG, Passive Serial, Active Serial |
| Lead-Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |