EP2C50F484C6 vs EP2C50F484C7N Vergleich
Detaillierter Direktvergleich von EP2C50F484C6 von Intel und EP2C50F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C50F484C6 | EP2C50F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $110,00 | $155,00 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 50,528 | — |
| Configurable Logic Blocks (CLBs) | 3,158 | — |
| Total RAM Bits | 594,432 bit | 594,432 bit |
| Embedded Memory Blocks | M4K blocks, 4 Kbit each | — |
| Total On-Chip Memory | 8 Mbit | — |
| DSP / Multiplier Blocks | 18-bit x 18-bit hardware multipliers | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 294 | — |
| Process Technology | 90 nm CMOS | 90 nm low-power CMOS |
| Core Voltage | 1.2 V | 1.0 V (internal, regulated) |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | C6 | C7 (commercial) |
| Betriebstemperatur | 0C to +85C (commercial) | 0 °C to +85 °C (commercial) |
| Gehäuse | 484-ball FineLine BGA (F484), 1.0 mm pitch | 484-ball FineLine BGA (1.0 mm pitch) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) | — |
| RoHS-Status | Compliant | Compliant (lead-free, Pb-free) |
| Logic Elements (LE) | — | 50,528 |
| Embedded RAM Blocks | — | M4K (4 Kbit each) |
| User I/O Count | — | 294 |
| Global Clock Networks | — | 16 |
| DSP / Hardware Multipliers | — | Yes (embedded multiplier blocks) |
| Configuration Interface | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Status | — | Not Recommended for New Designs (NRND); mature, long-life-cycle part |