EP2C70F672C6N vs EP2C70F672C8KK Vergleich
Detaillierter Direktvergleich von EP2C70F672C6N von Intel und EP2C70F672C8KK von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C70F672C6N | EP2C70F672C8KK |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $260,80 | $195,00 |
| Family | Cyclone II | Cyclone II |
| Series | EP2C70 | — |
| Logic Elements | 68,416 | — |
| Logic Array Blocks (LABs) | 4,276 | — |
| Total RAM Bits | 1,152,000 | — |
| Embedded 18x18 Multipliers | 150 | 150 |
| PLLs | 4 | 4 |
| Maximum User I/O | 422 | 422 |
| I/O Banks | 8 | — |
| Gehäuse | 672-ball FBGA, 27x27 mm, 1.0 mm pitch | 672-pin FBGA |
| Speed Grade | C6 | 8 (C8) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Process Technology | 90 nm low-k CMOS, copper interconnect | 90 nm |
| Configuration Memory | SRAM (volatile) | — |
| Configuration Schemes | AS, AP, PS, JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Lead-free (per FBGA marking) | Compliant |
| Logic Elements (LE) | — | 68,416 |
| Embedded Memory (Bits) | — | 1,152,000 (4,225 Kbits) |
| Global Clock Networks | — | 16 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 402.58 MHz |
| Configuration Method | — | Active Serial (AS), Passive Serial (PS), JTAG |