EP2C70F672C8KK vs EP2C70F672C6N Vergleich
Detaillierter Direktvergleich von EP2C70F672C8KK von Intel und EP2C70F672C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C70F672C8KK | EP2C70F672C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $260,80 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Embedded Memory (Bits) | 1,152,000 (4,225 Kbits) | — |
| Embedded 18x18 Multipliers | 150 | 150 |
| Maximum User I/O | 422 | 422 |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm low-k CMOS, copper interconnect |
| Maximum Internal Frequency | 402.58 MHz | — |
| Speed Grade | 8 (C8) | C6 |
| Gehäuse | 672-pin FBGA | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Method | Active Serial (AS), Passive Serial (PS), JTAG | — |
| RoHS-Status | Compliant | Lead-free (per FBGA marking) |
| Series | — | EP2C70 |
| Logic Elements | — | 68,416 |
| Logic Array Blocks (LABs) | — | 4,276 |
| Total RAM Bits | — | 1,152,000 |
| I/O Banks | — | 8 |
| Configuration Memory | — | SRAM (volatile) |
| Configuration Schemes | — | AS, AP, PS, JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |