EP2C70F672I8N vs EP2C70F672C6N Vergleich
Detaillierter Direktvergleich von EP2C70F672I8N von Intel und EP2C70F672C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C70F672I8N | EP2C70F672C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $260,80 |
| Series | Cyclone II | EP2C70 |
| Family | Cyclone II FPGA | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Logic Array Blocks (LAB) | 4,276 | — |
| Embedded Memory | 1,152 Kbit (1152 Kb) | — |
| M4K RAM Blocks | 250 | — |
| Embedded 18x18 Multipliers | 150 | 150 |
| User I/O Count | 422 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Maximum Internal Frequency | 402.5 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm low-k CMOS, copper interconnect |
| Core Voltage | 1.2 V (typ) | — |
| Betriebstemperatur | 0C to 85C (Industrial) | 0C to +85C (commercial) |
| Gehäuse | 672-ball FBGA (FineLine BGA) | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead Free | Yes (per datasheets.com) | — |
| RoHS-Status | Compliant | Lead-free (per FBGA marking) |
| Logic Elements | — | 68,416 |
| Logic Array Blocks (LABs) | — | 4,276 |
| Total RAM Bits | — | 1,152,000 |
| Maximum User I/O | — | 422 |
| I/O Banks | — | 8 |
| Speed Grade | — | C6 |
| Configuration Memory | — | SRAM (volatile) |
| Configuration Schemes | — | AS, AP, PS, JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |