EP2S130F1508I4TT vs EP2S130F1508C5 Vergleich
Detaillierter Direktvergleich von EP2S130F1508I4TT von Intel und EP2S130F1508C5 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2S130F1508I4TT - 132K LE Stratix II FPGA, 1508-BGA | Intel
EP2S130F1508I4TT ⚠ Letzte BestellmöglichkeitAltera
EP2S130F1508C5 - Stratix II FPGA, 132K LEs, 1508-FBGA | Intel / Altera
EP2S130F1508C5 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2S130F1508I4TT | EP2S130F1508C5 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.620,00 | $345,00 |
| Series | Stratix II | Stratix II |
| Logic Elements (LE) | 132,540 | — |
| Total RAM Bits | 6,747,840 (~6.4 Mbit) | — |
| User I/O Count | 1,126 | 1,126 |
| Gehäuse | 1508-BBGA, FCBGA (FineLine BGA) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial, speed grade -4) | Commercial (0 C to +85 C) |
| Process Node | 90 nm | — |
| DSP Blocks | Yes (dedicated 36x18 multipliers) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Embedded Memory Type | TriMatrix (three block sizes per memory block) | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| I/O Standard Support | LVTTL, LVCMOS, LVDS, LVPECL, SSTL, HSTL (per family datasheet) | — |
| Speed Grade | -4 (mid-band) | C5 (commercial) |
| Temperature Grade | Industrial | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | Intel / Altera |
| Logic Elements / Cells | — | 132,540 |
| Logic Array Blocks (LABs) | — | 6,627 |
| Number of CLBs | — | 53,016 |
| Embedded Memory (Bits) | — | 6,747,840 (approx. 6.7 Mbit) |
| Embedded 18x18 Multipliers | — | 252 |
| Core Voltage | — | 1.15 V to 1.25 V |
| Process Technology | — | 90 nm CMOS |
| Gehäuse / Bauform | — | 1508-BBGA, FCBGA (FineLine BGA) |
| Package Dimensions | — | 40 x 40 mm |
| Ball Pitch | — | 1.0 mm |