EP2S15F484C3N vs EP2S15F484I4N Vergleich
Detaillierter Direktvergleich von EP2S15F484C3N von Intel und EP2S15F484I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S15F484C3N | EP2S15F484I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $155,00 | $0,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 15,600 | 15,600 |
| Embedded Memory (bits) | 419,328 | — |
| Embedded Memory (Kb) | 306 Kb | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/O Pins | 342 | 342 |
| Gehäuse | 484-ball FBGA (FineLine BGA) | 484-BBGA |
| Speed Grade | C3 | — |
| Betriebstemperatur | Commercial / industrial (per C3 ordering code) | — |
| Supply Voltage Core | [DATA_NEEDED: core VCC | — |
| Configuration Modes | Active Serial, Passive Serial, Fast Passive Parallel, JTAG | — |
| PLLs | Up to 12 | — |
| External Memory Support | DDR, DDR2, SDRAM, QDR, RLDRAM | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI/PCI-X | — |
| RoHS-Status | Compliant (FBGA package) | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Embedded Memory | — | 419,328 bits |
| Configurable Logic Blocks | — | 780 |
| Operating Voltage | — | 1.2 V |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Montageart | — | Surface Mount |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Maximale Taktfrequenz | — | [DATA_NEEDED: maximum clock frequency] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |