EP2S180F1020C3 vs EP2S180F1020C3TT Vergleich
Detaillierter Direktvergleich von EP2S180F1020C3 von Intel und EP2S180F1020C3TT von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S180F1020C3 | EP2S180F1020C3TT |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.280,00 | $365,00 |
| Series | Stratix II | EP2S180 |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| Gehäuse | 1020-ball FBGA (flip-chip BGA) | 1020-BBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 90 nm, all-layer copper SRAM | 90 nm |
| Core Voltage | 1.2 V | — |
| Speed Grade | C3 | C3 |
| Betriebstemperatur | Commercial (0C to +85C) | — |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Family | — | Stratix II |
| Logic Elements (LEs) | — | 179,400 |
| Total Memory Bits | — | 9,383,040 |
| User I/O Count | — | 742 |
| Operating Temperature Grade | — | Commercial / Industrial (per suffix) |
| Configuration | — | SRAM-based, in-system reconfigurable |
| Lead-Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Logic Block Architecture | — | Adaptive Logic Module (ALM), 8-input fracturable LUT |