EP2S180F1020C3N vs EP2S180F1020C3 Vergleich
Detaillierter Direktvergleich von EP2S180F1020C3N von Intel und EP2S180F1020C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S180F1020C3N | EP2S180F1020C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.800,00 | $1.280,00 |
| Series | Stratix II | Stratix II |
| Family | Stratix II EP2S180 | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 179400 | — |
| Total RAM Bits | 9383040 | — |
| Number of LABs | 8970 | — |
| Number of I/O | 742 | — |
| DSP Blocks | 96 | Dedicated high-speed multipliers |
| PLLs | 12 | — |
| Core Voltage - Supply | 1.15 V to 1.25 V | — |
| Betriebstemperatur | 0 C to +85 C (Commercial) | Commercial (0C to +85C) |
| Speed Grade | -3 (slower) | C3 |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 1020-BBGA, FCBGA (33 x 33 mm) | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Logic Array Blocks (LABs) | — | 8,970 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Gehäuse | — | 1020-ball FBGA (flip-chip BGA) |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |