EP2S180F1020I4 vs EP2S60F1020I4 Vergleich
Detaillierter Direktvergleich von EP2S180F1020I4 von Intel und EP2S60F1020I4 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S180F1020I4 | EP2S60F1020I4 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11.250,00 | $1.454,92 |
| Series | Stratix II | Stratix II |
| Family | Stratix II (EP2S180) | — |
| Logic Elements | 179,400 | — |
| Number of LABs/CLBs | 8,970 | 3022 |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | — |
| Number of I/O | 742 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | — |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | 12 |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Maximum Operating Frequency | 711.24 MHz | — |
| Betriebstemperatur | -40C to +100C (Industrial grade, "I4" suffix) | — |
| Gehäuse | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating from Altera packaging spec] | — |
| RoHS-Status | Compliant | Non-compliant (contains lead per legacy Altera package) |
| Lead-Free | Yes | — |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | Passive Serial / Fast Passive Parallel / JTAG |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | — |
| Supplier Device Package | 1020-FBGA | — |
| Base Part Number | EP2S180 | — |
| Manufacturer | — | Intel / Altera |
| Logic Elements (LEs) | — | 60,440 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 24176 |
| Maximum User I/O | — | 718 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Operating Voltage (Core) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C TJ) |
| Package Type | — | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Global Clock Networks | — | 16 |
| Embedded Multipliers (18x18) | — | 36 |
| Transceiver Count | — | 0 (no embedded transceivers) |
| Maximum Embedded Memory Bandwidth | — | [DATA_NEEDED: memory bandwidth spec] |