EP2S30F484C3 vs EP2S30F484C3N Vergleich

Detaillierter Direktvergleich von EP2S30F484C3 von Intel und EP2S30F484C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2S30F484C3 EP2S30F484C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $620,00 $797,96
Family Stratix II —
Logic Elements 33,880 —
LABs / CLBs 1,694 —
Total RAM Bits 1,369,728 1369728 bits
Number of User I/O 342 —
Number of I/O Pins (Package) 500 —
Core Voltage 1.20 V —
Operating Temperature (Max) 85 C (Commercial) —
Speed Grade C3 —
Gehäuse 484-BBGA, FCBGA, 23 x 23 mm, 1.0 mm pitch —
Montageart Surface Mount Surface Mount
Process Technology 90 nm CMOS —
Embedded Memory Type TriMatrix (true dual-port, FIFO) —
Embedded DSP Blocks Yes —
PLL Count Multiple (per family datasheet) —
RoHS-Status [DATA_NEEDED: rohs status] —
FPGA Family — Stratix II
Number of Logic Elements/Cells — 33880 cells
Number of LABs — 1694 LABs
Number of User I/Os — 342
Core Supply Voltage — 1.2 V
Maximum Internal Frequency — 816.99 MHz
Technology Process — 90 nm CMOS
Gehäuse / Bauform — 484-BBGA, FC-FBGA
Number of Ball Terminals — 484
Terminal Form — Ball
Package Shape — Square
Embedded Memory Blocks — [DATA_NEEDED: exact M4K/M512/M-RAM block counts]
Embedded Multipliers — [DATA_NEEDED: number of 18x18 embedded multipliers]

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