EP2S30F484C3 vs EP2S30F484I4N Vergleich
Detaillierter Direktvergleich von EP2S30F484C3 von Intel und EP2S30F484I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S30F484C3 | EP2S30F484I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $620,00 | $305,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 33,880 | 33,880 |
| LABs / CLBs | 1,694 | — |
| Total RAM Bits | 1,369,728 | — |
| Number of User I/O | 342 | — |
| Number of I/O Pins (Package) | 500 | — |
| Core Voltage | 1.20 V | 1.2 V (refer to datasheet) |
| Operating Temperature (Max) | 85 C (Commercial) | — |
| Speed Grade | C3 | 4 |
| Gehäuse | 484-BBGA, FCBGA, 23 x 23 mm, 1.0 mm pitch | 484-ball FineLine BGA (FBGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS | 90 nm |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO) | — |
| Embedded DSP Blocks | Yes | — |
| PLL Count | Multiple (per family datasheet) | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | — |
| Embedded Memory | — | 1,369,728 bits |
| User I/O Pins | — | 342 |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial -40C to +100C |
| Lead-Free / RoHS | — | Yes (N suffix indicates lead-free RoHS) |
| On-Chip DSP Blocks | — | Yes (dedicated 9x9/18x18/36x36 multipliers) |
| PLLs | — | Yes (on-chip, refer to datasheet for count) |
| Configuration Method | — | Serial/parallel via Quartus II |