EP2S60F1020C4N vs EP2S60F1020I4 Vergleich
Detaillierter Direktvergleich von EP2S60F1020C4N von Intel und EP2S60F1020I4 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S60F1020C4N | EP2S60F1020I4 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $67,00 | $1.454,92 |
| Series | Stratix II | Stratix II |
| Family | Stratix II (EP2S60) | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 (approx.) | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 |
| Embedded Memory Blocks | M512/M4K/M-RAM TriMatrix memory | — |
| DSP Blocks (18-bit x 18-bit) | Up to 48 (24 per DSP block column pair typical) | — |
| User I/Os | 718 | — |
| Maximum Core Frequency | 711.24 MHz (per Arrow listing) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Gehäuse | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Operating Temperature Grade | Commercial (C4 suffix indicates commercial, speed grade 4) | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| PLLs / Clock Networks | Yes - on-chip PLLs and global clock networks | — |
| RoHS-Status | EU RoHS compliant with exemption (per Arrow listing) | Non-compliant (contains lead per legacy Altera package) |
| Manufacturer | — | Intel / Altera |
| Logic Elements (LEs) | — | 60,440 |
| Number of LABs/CLBs | — | 3022 |
| Number of CLBs | — | 24176 |
| Maximum User I/O | — | 718 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Operating Voltage (Core) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C TJ) |
| Package Type | — | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| Number of PLLs | — | 12 |
| Global Clock Networks | — | 16 |
| Embedded Multipliers (18x18) | — | 36 |
| Transceiver Count | — | 0 (no embedded transceivers) |
| Maximum Embedded Memory Bandwidth | — | [DATA_NEEDED: memory bandwidth spec] |