EP2SGX30CF780C6 vs EP2SGX30CF780C7 Vergleich
Detaillierter Direktvergleich von EP2SGX30CF780C6 von Intel und EP2SGX30CF780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX30CF780C6 | EP2SGX30CF780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $165,00 | $171,00 |
| Family | Stratix II GX | — |
| Series | EP2SGX | Stratix II GX |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 3.125 Gbps |
| Gehäuse | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (CF780) |
| Speed Grade | C6 (commercial, mid-speed) | C7 (fastest commercial) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (lead-free Fineline BGA) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 33,000 |
| Embedded Memory | — | 1.9 Mbits |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| PLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |