EP2SGX30CF780I3 vs EP2SGX30CF780C6 Vergleich

Detaillierter Direktvergleich von EP2SGX30CF780I3 von Intel und EP2SGX30CF780C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2SGX30CF780I3 EP2SGX30CF780C6
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $171,00 $165,00
Family Stratix II GX Stratix II GX
Logic Cells 33,880 —
Logic Array Blocks (LABs) 33,880 —
Maximum Internal Frequency 622.08 MHz —
Number of User I/O Pins 361 —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V (typical)
Transceivers Embedded multi-gigabit transceivers (6.375 Gbps) —
Gehäuse 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) 780-ball FineLine BGA (F780)
Terminal Pitch 1.0 mm —
Betriebstemperatur -40 °C to +85 °C (Industrial) 0C to +85C (commercial)
Temperature Grade Suffix I3 (Industrial) —
Montageart Surface Mount (BGA) —
Total Terminals 780 —
Package Code BGA, square shape —
RoHS-Status [DATA_NEEDED: RoHS status not confirmed in supplied data] [DATA_NEEDED: RoHS status]
Series — EP2SGX
Logic Elements (LE) — 33,880
Adaptive Logic Modules (ALM) — 13,540
Embedded Memory Bits — 1,369,728 bits (171 KBytes)
Embedded Multiplier 18x18 — 64 (estimated, datasheet required for exact count)
User I/O Pins — 361
High-Speed Transceivers — Up to 8 channels (FPGA-dependent configuration)
Transceiver Data Rate — Up to 6.375 Gbps
Speed Grade — C6 (commercial, mid-speed)
Configuration Mode — Enhanced passive/active (EPC) supported
Lead-Free — [DATA_NEEDED: lead-free status]

Datenblätter & Ressourcen

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