EP2SGX30DF780C4 vs EP2SGX30DF780C7 Vergleich
Detaillierter Direktvergleich von EP2SGX30DF780C4 von Intel und EP2SGX30DF780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX30DF780C7 - Stratix II GX FPGA 33.7K LE | Intel (Altera) | 780-BGA
EP2SGX30DF780C7 ObsoleteSpezifikationsvergleich
| Parameter | EP2SGX30DF780C4 | EP2SGX30DF780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,00 | $125,40 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells | 33,880 | — |
| Number of LABs / CLBs | 1,694 | — |
| Total Number of I/Os | 361 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Number of Transceivers | 20 (embedded multi-gigabit) | — |
| Core Voltage | 1.2 V | — |
| Gehäuse | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) | 780-Ball FBGA (DF780), 1.0 mm pitch |
| Montageart | Surface Mount | — |
| Process Technology | 90 nm CMOS | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Programmable Terminals | BGA ball grid (780 terminals) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant (per manufacturer product page) | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Series | — | Stratix II GX |
| Logic Elements (LE) | — | 33,880 |
| Embedded Memory (bits) | — | 1,369,728 |
| Memory Blocks | — | 482 (M512/M4K/M-RAM) |
| DSP Blocks | — | 24 |
| 18x18 Multipliers | — | 192 |
| Maximum User I/O | — | 361 |
| Speed Grade | — | -7 |
| Betriebstemperatur | — | 0C to +85C (Commercial) |
| Process Node | — | 90 nm |
| Core Voltage (VCCINT) | — | 1.2 V (typ) |
| Configuration | — | PS / FPP / JTAG |
| Transceiver Data Rate | — | [DATA_NEEDED: SERDES data rate] |