EP2SGX30DF780C5 vs EP2SGX30DF780C7 Vergleich
Detaillierter Direktvergleich von EP2SGX30DF780C5 von Intel und EP2SGX30DF780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX30DF780C7 - Stratix II GX FPGA 33.7K LE | Intel (Altera) | 780-BGA
EP2SGX30DF780C7 ObsoleteSpezifikationsvergleich
| Parameter | EP2SGX30DF780C5 | EP2SGX30DF780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $384,62 | $125,40 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 33,880 | 33,880 |
| LABs/CLBs | 1694 | — |
| Total RAM Bits | 1,369,728 bits | — |
| Number of Logic Cells | 33,880 cells | — |
| Maximum User I/Os | 361 | — |
| Transceiver Channels | 4 (up to 3.125 Gbps each) | — |
| Internal Frequency (max) | 609.76 MHz | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Betriebstemperatur | -40C to +85C (commercial) | 0C to +85C (Commercial) |
| Gehäuse | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch | 780-Ball FBGA (DF780), 1.0 mm pitch |
| Montageart | Surface Mount | — |
| Speed Grade | -5 | -7 |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status from verified data] | [DATA_NEEDED: RoHS status] |
| Series | — | Stratix II GX |
| Embedded Memory (bits) | — | 1,369,728 |
| Memory Blocks | — | 482 (M512/M4K/M-RAM) |
| DSP Blocks | — | 24 |
| 18x18 Multipliers | — | 192 |
| Maximum User I/O | — | 361 |
| Process Node | — | 90 nm |
| Core Voltage (VCCINT) | — | 1.2 V (typ) |
| Configuration | — | PS / FPP / JTAG |
| Transceiver Data Rate | — | [DATA_NEEDED: SERDES data rate] |