EP2SGX30DF780C7 vs EP2SGX30DF780I4 Vergleich

Detaillierter Direktvergleich von EP2SGX30DF780C7 von Intel und EP2SGX30DF780I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2SGX30DF780I4 EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel

EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel

EP2SGX30DF780I4 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2SGX30DF780C7 EP2SGX30DF780I4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $125,40 $178,25
Family Stratix II GX Stratix II GX
Series Stratix II GX Stratix II GX
Logic Elements (LE) 33,880 —
Embedded Memory (bits) 1,369,728 —
Memory Blocks 482 (M512/M4K/M-RAM) —
DSP Blocks 24 —
18x18 Multipliers 192 —
Maximum User I/O 361 —
Speed Grade -7 —
Gehäuse 780-Ball FBGA (DF780), 1.0 mm pitch 780-ball FC-FBGA, 29x29 mm, 1 mm pitch
Betriebstemperatur 0C to +85C (Commercial) -40C to +85C (Industrial)
Process Node 90 nm —
Core Voltage (VCCINT) 1.2 V (typ) —
Configuration PS / FPP / JTAG —
Transceiver Data Rate [DATA_NEEDED: SERDES data rate] —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Logic Elements / Cells — 33,880
Total RAM Bits — 1,369,728
Number of LABs — 1,694
User I/O Count — 361
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Nominal Supply Voltage (Core) — 1.2 V
Internal Operating Frequency — 622 MHz
Maximale Taktfrequenz — 717 MHz
Process Technology — 90 nm CMOS
Montageart — Surface Mount (Flip-chip BGA)
Lead-Free — [DATA_NEEDED: lead-free status]
MSL-Level — [DATA_NEEDED: MSL level]
Number of Transceivers — [DATA_NEEDED: number of transceiver channels]
Number of PLLs / DLLs — [DATA_NEEDED: number of PLLs]

Datenblätter & Ressourcen

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