EP2SGX60CF780C3 vs EP2SGX60CF780C3N Vergleich
Detaillierter Direktvergleich von EP2SGX60CF780C3 von Intel und EP2SGX60CF780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX60CF780C3 | EP2SGX60CF780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $870,00 | $285,00 |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA (Field Programmable Gate Array) |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | [DATA_NEEDED: LAB count] |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Speed Grade | C3 (commercial) | — |
| Gehäuse | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | — |
| Betriebstemperatur | Commercial (0C to +85C junction) | — |
| Montageart | Surface Mount (BGA) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Lead-free / Compliant |
| Series | — | Stratix II GX |
| User I/O Pins | — | 364 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 60,440 |
| Internal Frequency (max) | — | 816.9 MHz |
| Core Supply Voltage | — | 1.2 V |
| Transceiver Channels | — | 12 (up to 6.375 Gbps) |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm pitch |