EP2SGX60CF780C3N vs EP2SGX60CF780C4 Vergleich
Detaillierter Direktvergleich von EP2SGX60CF780C3N von Intel und EP2SGX60CF780C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX60CF780C3N | EP2SGX60CF780C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $285,00 | $171,00 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Series | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| User I/O Pins | 364 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Number of CLBs | 60,440 | — |
| Internal Frequency (max) | 816.9 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Transceiver Channels | 12 (up to 6.375 Gbps) | — |
| Package Type | 780-ball FC-FBGA | Flip-Chip Fine-Pitch BGA |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm pitch | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | Lead-free / Compliant | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | Stratix II GX |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 3,022 |
| User I/O Count | — | 364 |
| Total Memory Bits | — | 2,544,192 |
| Number of Transceivers | — | [DATA_NEEDED: number of transceivers] |
| Internal Operating Frequency | — | up to 732.1 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Gehäuse | — | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) |
| Speed Grade | — | C4 (commercial) |
| Betriebstemperatur | — | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] |
| Montageart | — | Surface Mount |