EP2SGX60CF780C4 vs EP2SGX60DF780C3 Vergleich
Detaillierter Direktvergleich von EP2SGX60CF780C4 von Intel und EP2SGX60DF780C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60CF780C4 | EP2SGX60DF780C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $218,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | Up to 20 |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Gehäuse | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Package Type | Flip-Chip Fine-Pitch BGA | — |
| Speed Grade | C4 (commercial) | C3 (fastest commercial) |
| Betriebstemperatur | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Family | — | Stratix II GX |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 364 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Core Voltage | — | 1.2 V |
| Internal Frequency (max) | — | ~717 MHz |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |