EP2SGX60CF780C5N vs EP2SGX60DF780C7 Vergleich
Detaillierter Direktvergleich von EP2SGX60CF780C5N von Intel und EP2SGX60DF780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N ⚠ Letzte BestellmöglichkeitIntel
EP2SGX60DF780C7 - Stratix II GX 60K LE FPGA, 364 I/O, 780-BGA | Intel
EP2SGX60DF780C7 ObsoleteSpezifikationsvergleich
| Parameter | EP2SGX60CF780C5N | EP2SGX60DF780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $485,00 | $348,00 |
| Series | Stratix II GX | — |
| Logic Elements | 60,440 (60K LE) | 60,440 |
| Logic Array Blocks (LABs) | 3022 | 3,022 |
| Total RAM Bits | 2,544,192 (approximately 2.5 Mbit) | 2,544,192 |
| User I/Os | 364 | — |
| High-Speed Transceiver Channels | 20 (up to 6.375 Gbps per channel) | — |
| Core Voltage | 1.15 V to 1.25 V | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Gehäuse | 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1), passive/active serial | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Operating Temperature Grade | Commercial (C) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Family | — | Stratix II GX |
| User I/O Pins | — | 364 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Junction Temperature (Commercial) | — | 0 C to 85 C |
| Speed Grade | — | C7 (slowest commercial) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Design Software | — | Quartus II (legacy, EOL toolchain) |