EP2SGX60DF780C3 vs EP2SGX60CF780I4N Vergleich

Detaillierter Direktvergleich von EP2SGX60DF780C3 von Intel und EP2SGX60CF780I4N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60DF780C3 EP2SGX60CF780I4N
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $218,00 $171,00
Family Stratix II GX Stratix II GX
Series Stratix II —
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 —
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 Up to 20
Transceiver Data Rate Up to 6.375 Gbps 622 Mbps to 6.375 Gbps
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
Internal Frequency (max) ~717 MHz —
Gehäuse 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch —
Montageart Surface Mount Surface Mount
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) —
RoHS-Status Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) Compliant
Device Type — FPGA
Logic Elements — 60,440
Logic Blocks / CLBs — 60,440
Embedded Memory — 2,542 Kbit (TriMatrix)
Core Supply Voltage — 1.2 V (range 1.15 V to 1.25 V)
Maximum Internal Frequency — 717 MHz
Number of PLLs — 12 (4 fast + 8 enhanced)
Global Clock Networks — 16
Package Type — FC-FBGA-780 (BGA-780)
Package Size — 23 x 23 mm
Ball Pitch — 1.0 mm
Operating Temperature Grade — Industrial

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