EP2SGX60DF780C3N vs EP2SGX60DF780C7 Vergleich
Detaillierter Direktvergleich von EP2SGX60DF780C3N von Intel und EP2SGX60DF780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60DF780C7 - Stratix II GX 60K LE FPGA, 364 I/O, 780-BGA | Intel
EP2SGX60DF780C7 ObsoleteSpezifikationsvergleich
| Parameter | EP2SGX60DF780C3N | EP2SGX60DF780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $188,00 | $348,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA | — |
| Logic Elements | 60,440 | 60,440 |
| LABs/CLBs | 3,022 | — |
| Total Memory Bits | 2,544,192 | — |
| User I/Os | 364 | — |
| Package Type | 780-pin FC-FBGA (DF780) | — |
| Package Dimensions | 23 x 23 mm | — |
| Pitch | 1 mm | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range C] | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant (per distributor listing) | [DATA_NEEDED: RoHS status] |
| Logic Array Blocks (LABs) | — | 3,022 |
| Total RAM Bits | — | 2,544,192 |
| User I/O Pins | — | 364 |
| Gehäuse | — | 780-ball FBGA (FineLine BGA) |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Junction Temperature (Commercial) | — | 0 C to 85 C |
| Speed Grade | — | C7 (slowest commercial) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Design Software | — | Quartus II (legacy, EOL toolchain) |