EP2SGX60EF1152I3N vs EP2SGX60EF1152I4N Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152I3N von Intel und EP2SGX60EF1152I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60EF1152I3N | EP2SGX60EF1152I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.195,00 | $0,00 |
| Family | Stratix II GX | — |
| Device Type | Field-Programmable Gate Array (FPGA) | FPGA |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | Other, 23 x 23 mm, 1 mm pitch, MS-034AAJ-1, FBGA-484 |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| RoHS-Status | Compliant | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Montageart | Surface Mount (BGA) | Surface mount |
| Product Family | — | Stratix II GX |
| Logic Cells | — | 60,440 |
| Embedded Memory | — | 2,544,192 bits |
| I/O Count | — | 534 |
| Internal Frequency | — | 717 MHz |
| Versorgungsspannung | — | 1.2 V |
| Gehäuse | — | 1,152-ball FBGA |
| Pins | — | 484 |
| Device Technology | — | 90 nm |
| Logic Blocks | — | 3,022 LABs |
| Operating Temperature Grade | — | Industrial |
| Compliance | — | [DATA_NEEDED: compliance certification details] |
| Transceiver Count | — | [DATA_NEEDED: high-speed transceiver count] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory specification] |
| Package Pinout | — | [DATA_NEEDED: complete ball-map pinout] |